DESCRIPTION
The HOLIGHT MMC-16 to 2×MTP-8 Breakout Cable is a next-generation VSFF (Very Small Form Factor)interconnect designed for high-density 400G/800G systems.
By combining an MMC-16 connector on one end with two MTP-8 connectors on the other, it efficiently consolidates parallel channels while maintaining outstanding optical performance.
With DirectConec push-pull boots, TMT Elite ferrules, and a plenum-rated flexible jacket, this cable minimizes space usage, simplifies installation, and delivers reliable performance in demanding data-center and telecom environments.
Feature Details
- VSFF Density Advantage
MMC connectors deliver three times the port density of MPO systems, enabling ultra-compact cabling architectures in limited rack space. - Dual MTP-8 Breakout Design
Aggregates two MTP-8 connections into one MMC-16, simplifying cabling routes and reducing panel congestion. - DirectConec Push-Pull Boot
Allows effortless connector handling without tools—ideal for high-density front panels. - TMT Elite Ferrule Performance
Achieves ≤ 0.35 dB insertion loss and high return loss for 400G/800G optical performance stability. - Flexible Mode Options
Available in OM4 multimode (Magenta)for short-reach and OS2 single-mode (Yellow)for long-distance transmission. - Bend-Insensitive and Durable
Engineered for tight routing with 7.5–10 mm bend radius and reinforced tensile strength. - Fire-Rated and Field-Ready
OFNP jacket ensures safety compliance for indoor plenum environments; each cable is 100 % factory tested.
Product Specifications
| Parameter | Description |
| Connector A | US Conec MMC Female (Pinless) |
| Connector B | 2 × US Conec MTP-8 Elite Female (Pinless) |
| Polish Type | PC/UPC (OM4), APC or UPC (OS2) |
| Fiber Type | OM4 50/125 μm (Multimode) / OS2 9/125 μm (Single-Mode) |
| Fiber Count | 16 Fibers (2× 8) |
| Wavelength | 850/1300 nm (OM4) / 1310/1550 nm (OS2) |
| Glass Fiber | Bend-Insensitive (OM4) / G.657.A1 (OS2) |
| Cable Diameter | 2.5 mm |
| Cable Jacket | Plenum (OFNP) |
| Polarity | Configurable per application (Type A / Type B / Type C) |
| Minimum Bend Radius | 7.5 mm (OM4) / 10 mm (OS2) |
| Insertion Loss | ≤ 0.35 dB |
| Return Loss | ≥ 40–45 dB (OM4) / ≥ 60 dB (OS2) |
| Attenuation @850 nm | ≤ 3.5 dB/km |
| Attenuation @1300 nm | ≤ 1.5 dB/km |
| Attenuation @1310 nm | ≤ 0.4 dB/km |
| Attenuation @1550 nm | ≤ 0.3 dB/km |
| Tensile Strength | 30 N (long term) / 100 N (short term) |
| Operating Temperature | −10℃ ~ +60℃ |
| Storage Temperature | −10℃ ~ +70℃ |
| Durability | ≥ 500 mating cycles |
Application Details
- 400G/800G Data Centers – Interconnect MMC patch panels with MTP modules to support next-gen transceivers.
- Hyperscale and Cloud Infrastructures – Optimize backbone and cross-connect performance in compact racks.
- Enterprise Networks – Deploy high-density breakout links for scalable optical LANs and SANs.
- Telecom Central Offices – Provide efficient fiber distribution and modular ODF connections.
- Testing and Integration Labs – Use for fast, repeatable optical setups and device validation.
FAQ
- What is an MMC Breakout Cable?
It’s a high-density assembly combining one MMC-16 connector with two MTP-8 connectors to simplify parallel optical distribution. - Which fiber types are available?
Both OM4 multimodefor short-range and OS2 single-modefor long-haul connections. - What is the advantage of MMC over MPO?
MMC offers 3× the port density of MPO, enabling smaller footprints and easier management in dense racks. - Can this cable be used with existing MTP panels?
Yes. The MTP-8 ends are fully compatible with standard MTP adapter panels and cassettes. - What is the difference between APC and UPC versions?
APC offers better return loss for single-mode applications, while UPC is commonly used in multimode links. - What safety rating does the cable meet?
OFNP (Plenum) rated for fire-safe installation in air-handling spaces. - Is customization available?
Yes. Length, fiber type, polish (APC/UPC), and jacket color can be customized on request. - Does HOLIGHT offer OEM/ODM services?
Yes, including private labeling, logo printing, and custom packaging for project deployment.
